Project:

LEIMSA - Lightweight Electronics by Injection Molding in Seamless Architecture

‍

Main Objective

Strengthening research, technological development, and innovation.

‍

Overview

LEIMSA - Lightweight Electronics by Injection Molding in Seamless Architecture - aims at developing disruptive components for automotive interiors, integrating IMD (In-Mold Decoration), IML (In-Mold Labelling) and IME (In-Mold Electronics) technologies to achieve smart and haptic 3D surfaces, with attractive designs and immersive HMI (Human-Machine Interface) for a complete user-centered experience.

‍

Partners

Simoldes Plásticos (Leader); Bosch Car Multimedia Portugal; CEiiA; CELOPLÁS; DTx; UMinho.

‍